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Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition (Repost)

Posted By: AvaxGenius
Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition (Repost)

Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition by James E. Morris
English | EPUB | 2018 | 1007 Pages | ISBN : 3319903616 | 194.1 MB

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement.

Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition (Repost)

Posted By: AvaxGenius
Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition (Repost)

Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition by James E. Morris
English | EPUB | 2018 | 1007 Pages | ISBN : 3319903616 | 194.1 MB

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement.

Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition (Repost)

Posted By: AvaxGenius
Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition (Repost)

Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition by James E. Morris
English | EPUB | 2018 | 1007 Pages | ISBN : 3319903616 | 194.1 MB

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement.